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TO Packages

Transistor Outline packages, are a two part construction; a TO header and a TO cap. We manufacture a wide array of conventional shapes and sizes of TO header including TO5, TO9, TO18, TO38, TO39, TO46, TO56, TO60, and TO65. Our R&D department also has full capabilities to work with clients on customized solutions.

 

TO Test Parameters:

Hermeticity

Leak rate is ≤1×10-3 Pa·cm 3/s

Insulation Resistance

 ≥1× 1010 Ω (500V DC) glass

Bending Resistance Test

Leads are bent to 90°, 3mm from substrate

Tensile Strength Test

1.5Kg weight is connected to lead for 30 seconds

Solderability Test

 Lead-free tin heated to 245 ℃±5 ℃ with KS-C-5W flux; immersion time 3 seconds

Pure Water Test

Immersion in deionized water at 25℃±5℃ for 24 hours


DETAILS

TO packages form the backbone for installing a wide range of optical and electronic components from basic electronic circuits all the up to semiconductors. Leads drawn out through the housing bring power to the sealed components. The performance of these components at the core of TO packages such as photo and laser diodes is of central importance because environmental factors can cause corrosion which in turn can bring about failure of the entire component. Jitai’s extensive experience with hermeticity brings a host of encapsulation techniques that ensure protection for the sealed components and that they are able to perform their intended function within the microelectronic package for years to come.

TO Packages

Parts

TO Header/TO Cap

Header Structures

Shelled/Stamped

Cap Structures

Lens Caps/ Window Caps

Base

Kovar/Alloy52/Alloy42/CRS

Pins

Kovar

Insulator

BH-A/K

Solder Ring

HLAgcu28

 

 TO46 Series

50 fgjdghj dsfghfgh

Base

Pins

Insulator

Solder Ring

Plating

Insulation Resistance

Hermeticity

4J42 4J29

BH-A/K

HLAgCu28

Ni 3~8.9μm, Au≥0.3μm

500V DC resistance between single glass sealed pin and base is ≥1×10^10 Ω

Leak rate is ≤1×10-3 Pa·cm 3/s

4J42 4J29

BH-A/K

HLAgCu28

Ni 3~8μm, Au≥0.3μm

4J29 4J29

BH-A/K

HLAgCu28

 Ni 2~8.9μm, Au≥0.3μm

4J29 4J29

BH-A/K

HLAgCu28

Ni 3~8.9μm, Au≥0.3μm

4J29 4J29

BH-A/K

HLAgCu28

Ni 1.3~8.9μm, Au≥0.7μm

Additional TO series; specs available upon request

TO60 Series TO60-7 pin MWDM
  TO60-8 pin
  TO60-7 pin
  TO60 double columned

 

TO 38  
TO65 TO65-6 pin
TO 9 Series TO9-1
  TO9-2

 

TO39 Series TO39 (2+1) nail head
  TO39 (2+1)
  TO39 (1+1)

 

TO5 Series TO5 (7+1)
  TO5 (5+1)
  TO5 (3+1)
  TO5 (2+1)
  TO5 (2+1) 2.0T
  TO5-4pin
  TO5 (3*4)
  TO5 (1.9*1.9)
  TO5 (4.9*4.9)
  TO5 sided window
TO56 Series TO56-7 pin
  TO56-7 pin MWDM
  TO56-7 pin EML
  TO56-7 pin (25G)
  TO56-7 pin TEC
  TO56-5 pin
  TO56-5 pin(25G)
  TO56-5 pin(25G) with heat sink
  TO56-6 pin (25G)
  TO56 (650nm)
  TO56(808nm)
  TO56 (2.5G)
  TO56-7 pin double columned
  TO56 flat

 

TO18 Series TO18 (3+1)
  TO18 (2+1)
  TO18 (1+1)
  TO18 (2+1) half circle
  TO18-2 pin

 

QUALITY CONTROL

Over the years we have finely tuned our multi-step process of ensuring every single component passes all quality and functionality tests, tests that begin even before raw materials are on-boarded.  At this first stage, each shipment of raw materials undergoes an acceptance sampling method assortment which makes a determination about whether to accept the material.  If such a determination is made, the entire shipment is cleaned, a full inspection is performed, minor imperfections are buffed and polished, and stock is then warehoused. The second stage is conducted immediately following the initial assembly and brazing stages. Every single product undergoes an individual visual inspection followed by a preliminary hermeticity test. For hermeticity we utilize a helium leak test that is adjusted to meet the exacting air tightness requirements of our clients. Following the plating stage, each batch undergoes a sampling inspection and a coating bonding degree analysis. Products that make it past this stage are then subjected to  full inspection which includes scrutiny of appearance, construction, plating thickness, and a second helium tracer gas hermeticity test. Finally products are put through the full range of Factory Inspection trials. These include pin fatigue tests, a salt spray corrosion resistance test and analysis that relies on climate simulation equipment to test product performance. Once products are approved, they are individually vacuum-packed with a deoxidizing desiccant insert and ensconced in additional protective packaging before being shipped out. These efforts guarantee that every Jitai product delivered to you is of the same high quality as when it left the factory.


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