TO Packages
TO packages form the backbone for installing a wide range of optical and electronic components from basic electronic circuits all the up to semiconductors. Leads drawn out through the housing bring power to the sealed components. The performance of these components at the core of TO packages such as photo and laser diodes is of central importance because environmental factors can cause corrosion which in turn can bring about failure of the entire component. Jitai’s extensive experience with hermeticity brings a host of encapsulation techniques that ensure protection for the sealed components and that they are able to perform their intended function within the microelectronic package for years to come.
TO Packages |
|
Parts |
TO Header/TO Cap |
Header Structures |
Shelled/Stamped |
Cap Structures |
Lens Caps/ Window Caps |
Base |
Kovar/Alloy52/Alloy42/CRS |
Pins |
Kovar |
Insulator |
BH-A/K |
Solder Ring |
HLAgcu28 |
Additional TO series; specs available upon request
TO60 Series | TO60-7 pin MWDM |
TO60-8 pin | |
TO60-7 pin | |
TO60 double columned |
TO 38 | |
TO65 | TO65-6 pin |
TO 9 Series | TO9-1 |
TO9-2 |
TO39 Series | TO39 (2+1) nail head |
TO39 (2+1) | |
TO39 (1+1) |
TO5 Series | TO5 (7+1) |
TO5 (5+1) | |
TO5 (3+1) | |
TO5 (2+1) | |
TO5 (2+1) 2.0T | |
TO5-4pin | |
TO5 (3*4) | |
TO5 (1.9*1.9) | |
TO5 (4.9*4.9) | |
TO5 sided window |
TO56 Series | TO56-7 pin |
TO56-7 pin MWDM | |
TO56-7 pin EML | |
TO56-7 pin (25G) | |
TO56-7 pin TEC | |
TO56-5 pin | |
TO56-5 pin(25G) | |
TO56-5 pin(25G) with heat sink | |
TO56-6 pin (25G) | |
TO56 (650nm) | |
TO56(808nm) | |
TO56 (2.5G) | |
TO56-7 pin double columned | |
TO56 flat |
TO18 Series | TO18 (3+1) |
TO18 (2+1) | |
TO18 (1+1) | |
TO18 (2+1) half circle | |
TO18-2 pin |
QUALITY CONTROL
Over the years we have finely tuned our multi-step process of ensuring every single component passes all quality and functionality tests, tests that begin even before raw materials are on-boarded. At this first stage, each shipment of raw materials undergoes an acceptance sampling method assortment which makes a determination about whether to accept the material. If such a determination is made, the entire shipment is cleaned, a full inspection is performed, minor imperfections are buffed and polished, and stock is then warehoused. The second stage is conducted immediately following the initial assembly and brazing stages. Every single product undergoes an individual visual inspection followed by a preliminary hermeticity test. For hermeticity we utilize a helium leak test that is adjusted to meet the exacting air tightness requirements of our clients. Following the plating stage, each batch undergoes a sampling inspection and a coating bonding degree analysis. Products that make it past this stage are then subjected to full inspection which includes scrutiny of appearance, construction, plating thickness, and a second helium tracer gas hermeticity test. Finally products are put through the full range of Factory Inspection trials. These include pin fatigue tests, a salt spray corrosion resistance test and analysis that relies on climate simulation equipment to test product performance. Once products are approved, they are individually vacuum-packed with a deoxidizing desiccant insert and ensconced in additional protective packaging before being shipped out. These efforts guarantee that every Jitai product delivered to you is of the same high quality as when it left the factory.