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Aluminum Alloy Packages

NonconventionalSpecial Materials1

SHORT DESCRIPTION:
The advantages of aluminum alloy are its light weight, robust strength, and the ease with which it can be molded. As such it is widely used in the manufacturing of electronic packaging.

MAIN FEATURES:
High thermal conductivity
•Low density
•Good platability and workability, wire cutting, grinding and surface gold plating can be performed.

MODEL COEFFICIENT OF THERMAL EXPANSION/×10-6 /K THERMAL CONDUCTIVITY/W·(m·K)-1 THE DENSITY OF/g·cm-3
A1 6061 22.6 210 2.7
A1 4047 21.6 193 2.6

Aluminum Silicon Metal Packages

Aluminum Silicon Metal Packages

SHORT DESCRIPTION:
Si/Al alloys for electronic packages mainly refer to eutectic alloy materials with a silicon content of 11% to 70%. Its density is low, the coefficient of thermal expansion can be matched to the chip and substrate, and its ability to dissipate heat is excellent. Its machining performance is also ideal. As a result, Si/Al alloys have      enormous potential in the electronic packaging industry.

MAIN FEATURES:
•Fast heat dissipation and high thermal conductivity can solve the heat dissipation problems inherent in the development of high-power devices.
•The coefficient of thermal expansion is controllable, which makes it possible to match that of the chip, avoiding excessive thermal stress that can cause device failure.
•Low density

CE Alloy designation Alloy composition CTE,ppm/℃,25-100℃ Density,g/cm3 Thermal Conductivity at 25℃ W/mK Bend Strength,MPa Yield Strength,MPa Elastic Modulus,GPa
CE20 Al-12%Si 20 2.7
CE17 Al-27%Si 16 2.6 177 210 183 92
CE17M Al-27%Si* 16 2.6 147 92
CE13 Al-42%Si 12.8 2.55 160 213 155 107
CE11 Si-50%Al 11 2.5 149 172 125 121
CE9 Si-40%Al 9 2.45 129 140 134 124
CE7 Si-30%Al 7.4 2.4 120 143 100 129

Diamond/Copper, Diamond/Aluminum

DiamondCopper, DiamondAluminum

SHORT DESCRIPTION:
Diamond/Copper and Diamond/Aluminum are composite materials with diamond as the reinforcing phase and copper or aluminum as the matrix material. These are very competitive and promising electronic packaging materials. For both diamond/copper and diamond/aluminum metal housing, the thermal conductivity of the chip area is ≥500W/( m•K) -1, satisfying the performance requirements of high heat dissipation of the circuit. With the continuous expansion of research, these types of housing will play an increasingly important role in the field of electronic packaging.

MAIN FEATURES:
•High thermal conductivity
•The coefficient of thermal expansion (CTE) can be controlled by changing the mass fraction of the diamond and Cu materials
•Low density
•Good platability and workability, wire cutting, grinding and surface gold plating can be carried out

MODEL COEFFICIENT OF THERMAL EXPANSION/×10-4/K THERMAL CONDUCTIVITY/W·(m·K)-1 THE DENSITY OF/g·cm-3
DIAMOND60%-COPPER40% 4 600 4.6
DIAMOND40%-COPPER60% 6 550 5.1
DIAMOND ALUMINUM 7 >450 3.2

AlN substrate

AlN substrate

SHORT DESCRIPTION:
Aluminum nitride ceramic is a technical ceramic material. It has excellent thermal, mechanical and electrical properties, such as high electrical conductivity, a small relative dielectric constant, a linear expansion coefficient matching silicon, excellent electrical insulation, and low density. It is non-toxic and strong. With the widespread development of microelectronic devices, aluminum nitride ceramics as a base material or for the package’s housing, has become increasingly popular. It is a promising high-power integrated circuit substrate and packaging material.

MAIN FEATURES:
•High thermal conductivity (about 270W/m•K), close to BeO and SiC, and more than 5 times that of Al2O3
•The thermal expansion coefficient matches Si and GaAs
•Excellent electrical properties (relatively small dielectric constant, dielectric loss, volume resistivity, dielectric strength)
•High mechanical strength and ideal machining performance
•Ideal optical and microwave characteristics
•Non-toxic


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