Jitai’s extensive line-up of packages for Hybrid Integrated Circuits includes products such as platform and sidewall packages. The exterior housing is formed by mechanical stamping, which has the advantage of high production efficiency and is therefore suitable for mass production. Pins are drawn straight out from the bottom, usually in a double-row or four-row arrangement, suitable for plug-in installation. Dual Inline packages (DIP) or Quad Inline packages are also designed for plug-in assembly. We rely on materials such as Kovar 4J29 (Fe/Ni/Co alloy), 4J42, CRS 1010, for housings, glass and ceramic for insulators, and work closely with our clients to suggest materials we know will bring their projects to life.